X-Ray Imaging and Computed Tomography is a contactless imaging technique used to observe internal structures of electronic components and systems.
The 3D volume is built by the software from a set of 2D x-rays images acquired at different angles of the sample. Once the volume reconstruction is performed, several post-treatment possibilities open up to analyse the virtual sample. For example, a virtual cross section can be performed following any given direction. A number of different grayscale images can also be produced, allowing an easier differentiation of the sample materials.
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Non-destructive
internal observation
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Assembly level short circuit on an electronic component
Voids rate
quantification
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Voids in a microprocessor solder BGAs