The quality of the assembly test process has direct consequences for the performance of electronic components, and affects their lifetime. At Intraspec we can perform a set of assembly test in order to evaluate their quality.
Control of packages
impermeability
Fine leaks,
Gross leaks
Mobile particles
detection
PIND test
(Particle Impact Noise Detection)
3 types
of tests
Wire Pull, Ball Shear and Die Shear
See below to find our other techniques
